Open AccessA Review of Moldflow and Finite Element Analysis Simulation of Chip Scale Packaging (CSP) for Light Emitting Diode (LED)
Author(s) -
Law Ruen Ching,
M. Z. Abdullah
Publication year - 2022
Publication title -
journal of advanced research in fluid mechanics and thermal sciences
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.247
H-Index - 13
ISSN - 2289-7879
DOI - 10.37934/arfmts.99.1.158173
Subject(s) - molding (decorative) , mechanical engineering , chip scale package , finite element method , light emitting diode , process (computing) , engineering , chip , computer science , engineering drawing , electrical engineering , structural engineering , operating system