Open AccessAnalytical Analysis on the Capillary Pressure of Underfill Flow Meniscus During the Flip-Chip Encapsulation Process
Author(s) -
Fei Chong Ng,
Lun Hao Tung,
Aizat Abas
Publication year - 2022
Publication title -
journal of advanced research in fluid mechanics and thermal sciences
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.247
H-Index - 13
ISSN - 2289-7879
DOI - 10.37934/arfmts.94.2.174183
Subject(s) - flip chip , capillary action , capillary pressure , materials science , meniscus , mechanics , composite material , optics , adhesive , porosity , physics , incidence (geometry) , porous medium , layer (electronics)