Open AccessEffect of Temperature on Solder Paste During Surface Mount Technology Printing
Author(s) -
Nur Hidayah Mansor,
Mohd Sharizal Abdul Aziz,
Nina Amanina Binti Marji,
Mohd Arif Anuar Mohd Salleh
Publication year - 2020
Publication title -
journal of advanced research in fluid mechanics and thermal sciences
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.247
H-Index - 13
ISSN - 2289-7879
DOI - 10.37934/arfmts.75.3.99107
Subject(s) - solder paste , surface mount technology , mount , soldering , materials science , metallurgy , composite material , mechanical engineering , engineering
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