Open AccessThermal Impact of Heat Spreader Co-Planarity to Electronic Packaging
Author(s) -
Pang Shi Shiang,
M. Z. Abdullah
Publication year - 2020
Publication title -
journal of advanced research in fluid mechanics and thermal sciences
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.247
H-Index - 13
ISSN - 2289-7879
DOI - 10.37934/arfmts.71.1.19
Subject(s) - planarity testing , heat spreader , materials science , electronic packaging , heat sink , thermal , composite material , mechanical engineering , chemistry , engineering , crystallography , thermodynamics , physics