Open AccessAtomic drift-less electromigration model for submicron copper interconnects
Author(s) -
Aparna Adhikari,
Arijit Roy,
Cher Ming Tan
Publication year - 2022
Publication title -
ymer digital
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.103
H-Index - 5
ISSN - 0044-0477
DOI - 10.37896/ymer21.07/94
Subject(s) - electromigration , void (composites) , interconnection , materials science , copper , scaling , electron , mechanics , engineering physics , physics , composite material , metallurgy , computer science , nuclear physics , computer network , geometry , mathematics
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