Open AccessMechanical and Thermal Properties of Epoxy Polymer Composites Reinforced with CuO
Author(s) -
Mahadeva Raju G. K,
AUTHOR_ID,
G. M. Madhu,
P. Dinesh Sankar Reddy,
K. Karthik,
AUTHOR_ID,
AUTHOR_ID,
AUTHOR_ID
Publication year - 2021
Publication title -
ymer
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.103
H-Index - 5
ISSN - 0044-0477
DOI - 10.37896/ymer20.12/25
Subject(s) - materials science , epoxy , composite material , micromechanics , ultimate tensile strength , young's modulus , nanocomposite , polymer , modulus , stiffness , composite number
Polymer nano composites using CuO as filler material and epoxy as matrix materials were prepared with different concentrations of CuO nano particles (1-5 wt%) by shear mixing followed by ultra-sonication process. The mechanical properties such as compressive strength and modulus were characterized using ASTM standards. It was found that the addition of CuO nano particles both compressive strength and modulus increased. As the CuO content increased in epoxy matrix the moduli values found to increase and were further analyzed using micromechanical models. The analytical models discussed correlate well with experimental values. The models discussed include Nicolais – Narkis, Turcsanyi, Piggot – Leidner and Nielsen models for the tensile strength values and for tensile modulus the models discussed include Halpin Tsai, Kerner and Sato – Furukawa models. These micromechanics models predict stiffness of nanocomposites with both aligned and randomly oriented fillers. XRD pattern revealed the interaction between CuO nanoparticles and epoxy matrix. The thermal decomposition behaviour revealed that there is an enhancement of onset of decomposition temperature by 28oC for 5wt% CuO filled epoxy than that of pure epoxy