Open AccessA Gauge Study of an Intercomparison Evaluation to Implement the use of Fine-Pitch Test Patterns for Surface Insulation Resistance (SIR) Testing of Solder Fluxes
Author(s) -
Chris Hunt
Publication year - 2022
Publication title -
journal of surface mount technology
Language(s) - English
Resource type - Journals
ISSN - 1093-7358
DOI - 10.37665/smt.v35i1.24
Subject(s) - gauge (firearms) , reliability (semiconductor) , computer science , point (geometry) , test (biology) , strain gauge , environmental science , reliability engineering , physics , materials science , electrical engineering , engineering , mathematics , geology , paleontology , power (physics) , geometry , quantum mechanics , metallurgy
SIR is a recognised tool for establishing electrochemical reliability of electronic assemblies. Currently the test patterns in the standards reflect coarse pitch components. An intercomparison has been completed with the aim of establishing the introduction of a fine pitch SIR pattern with a 200µm gap. This exercise included the contribution from seven international participants. This new pattern moves the test method forward into the realm of current technologies where components of this pitch are common place. The study reported here validates the basis for the introduction of the new pattern, and confirms acceptable Gauge R&R for the SIR technique. The analysis also highlights the challenges in controlling humidity to achieve comparable results between different users. The results also point to the challenges in achieving acceptable Gauge R&R when measuring resistances >1011Ω.