Open AccessEffect of a Multi-Step Gap-Filling Process to Improve Adhesion between Low-K Films and Metal Patterns
Author(s) -
Woojin Lee,
Tae Hyung Kim,
YongHo Choa
Publication year - 2016
Publication title -
korean journal of materials research
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.153
H-Index - 10
eISSN - 2287-7258
pISSN - 1225-0562
DOI - 10.3740/mrsk.2016.26.8.427
Subject(s) - materials science , shallow trench isolation , plasma enhanced chemical vapor deposition , deposition (geology) , trench , chemical vapor deposition , microelectronics , optoelectronics , dielectric , delamination (geology) , nanotechnology , layer (electronics) , paleontology , tectonics , sediment , subduction , biology
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