Open AccessCrystallographic Effects of Anode on the Mechanical Properties of Electrochemically Deposited Copper Films
Author(s) -
Byung-Hak Kang,
Jieun Park,
Kangju Park,
Dayoung Yoo,
Dajeong Lee,
Dongyun Lee
Publication year - 2016
Publication title -
korean journal of materials research
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.153
H-Index - 10
eISSN - 2287-7258
pISSN - 1225-0562
DOI - 10.3740/mrsk.2016.26.12.714
Subject(s) - materials science , anode , grain boundary , thin film , electrolyte , ultimate tensile strength , copper , electrochemistry , cathode , composite material , chemical engineering , electrode , metallurgy , microstructure , nanotechnology , chemistry , engineering
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