Open AccessDMAB Effects in Electroless Ni Plating for Flexible Printed Circuit Board
Author(s) -
Hyung Chul Kim,
SaKyun Rha,
YounSeoung Lee
Publication year - 2014
Publication title -
han'gug jaeryo haghoeji/han-guk jaeryo hakoeji
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.153
H-Index - 10
eISSN - 2287-7258
pISSN - 1225-0562
DOI - 10.3740/mrsk.2014.24.11.632
Subject(s) - materials science , electroless plating , printed circuit board , plating (geology) , electroless deposition , electroless nickel plating , nanotechnology , metallurgy , electrical engineering , engineering , electroplating , copper , layer (electronics) , geophysics , geology