Open AccessEffects of Current Density and Organic Additives on via Copper Electroplating for 3D Packaging
Author(s) -
Eun-Hey Choi,
YounSeoung Lee,
SaKyun Rha
Publication year - 2012
Publication title -
han'gug jaeryo haghoeji/han-guk jaeryo hakoeji
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.153
H-Index - 10
eISSN - 2287-7258
pISSN - 1225-0562
DOI - 10.3740/mrsk.2012.22.7.374
Subject(s) - materials science , current density , electroplating , trench , plating (geology) , copper plating , through silicon via , copper , void (composites) , composite material , aspect ratio (aeronautics) , metallurgy , silicon , layer (electronics) , physics , quantum mechanics , geophysics , geology