Open AccessEffects of Current Density and Organic Additives on via Copper Electroplating for 3D Packaging
Author(s) -
은혜 최,
연승 이,
사균 나
Publication year - 2012
Publication title -
korean journal of materials research
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.153
H-Index - 10
eISSN - 2287-7258
pISSN - 1225-0562
DOI - 10.3740/mrsk.2012.22.7.374
Subject(s) - materials science , current density , electroplating , trench , plating (geology) , copper plating , through silicon via , copper , void (composites) , composite material , aspect ratio (aeronautics) , metallurgy , silicon , layer (electronics) , physics , quantum mechanics , geophysics , geology
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