Open AccessLine Length Effect on Electromigration Characteristics of Eutectic SnPb Solder
Author(s) -
영배 박,
용덕 이,
장희 이,
민승 윤,
영창 주
Publication year - 2007
Publication title -
korean journal of materials research
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.153
H-Index - 10
eISSN - 2287-7258
pISSN - 1225-0562
DOI - 10.3740/mrsk.2007.17.7.361
Subject(s) - electromigration , materials science , eutectic system , soldering , metallurgy , composite material , microstructure
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