Open AccessLine Length Effect on Electromigration Characteristics of Eutectic SnPb Solder
Author(s) -
Seong-Hee Lee,
Chun-Su Kim,
Sangshik Kim,
Seong Ho Han,
Cha-Yong Lim
Publication year - 2007
Publication title -
han'gug jaeryo haghoeji/han-guk jaeryo hakoeji
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.153
H-Index - 10
eISSN - 2287-7258
pISSN - 1225-0562
DOI - 10.3740/mrsk.2007.17.7.361
Subject(s) - electromigration , materials science , eutectic system , soldering , metallurgy , composite material , microstructure