Open AccessAdhesion and Interface Chemical Reactions ofCu/CuO/Polyimide System
Author(s) -
명한 김,
경운 이,
홍철 채,
철민 최
Publication year - 2007
Publication title -
korean journal of materials research
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.153
H-Index - 10
eISSN - 2287-7258
pISSN - 1225-0562
DOI - 10.3740/mrsk.2007.17.2.061
Subject(s) - polyimide , materials science , layer (electronics) , oxide , x ray photoelectron spectroscopy , adhesion , composite material , volumetric flow rate , sputtering , copper oxide , surface roughness , thin film , chemical engineering , analytical chemistry (journal) , metallurgy , nanotechnology , organic chemistry , chemistry , engineering , physics , quantum mechanics
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