Open AccessAdhesion of Cu on Polycarbonate Medified by O2//Ar Plasma Treatment
Author(s) -
준규 박,
동원 김,
상호 김,
연승 이
Publication year - 2002
Publication title -
korean journal of materials research
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.153
H-Index - 10
eISSN - 2287-7258
pISSN - 1225-0562
DOI - 10.3740/mrsk.2002.12.9.740
Subject(s) - polycarbonate , materials science , adhesion , plasma , surface roughness , electrode , composite material , chemical engineering , adhesive , analytical chemistry (journal) , layer (electronics) , chromatography , chemistry , physics , quantum mechanics , engineering
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