
Thermal Modelling and Power Consumption Estimation of a Multi Floor Small Scale Building Using SPICE Simulator
Author(s) -
Philippe Dondon,
Cornelia Aida Bulucea
Publication year - 2022
Publication title -
wseas transactions on environment and development
Language(s) - English
Resource type - Journals
eISSN - 2224-3496
pISSN - 1790-5079
DOI - 10.37394/232015.2022.18.31
Subject(s) - modular design , scale (ratio) , spice , computer science , energy consumption , power consumption , power (physics) , building science , simulation , automotive engineering , industrial engineering , architectural engineering , engineering , electronic engineering , electrical engineering , physics , quantum mechanics , operating system
This study is a part of a concrete sustainable development project introduced at university. A small scale genuine materials house (1/20 scale) with its green energy sources and electronic circuits management have been designed for educational and research purpose [1]. Thanks to a modular design and optional accessories, many thermal and electronic measurements and modelling are possible, like in a real house. A SPICE equivalent thermal behaviour modelling is proposed. Once validated, a case of study for a three floor small scale building is presented. Power consumption and insulation efficiency are analyzed. Main tendencies are checked after comparison with a real multi floor building. Results are finally discussed.