Open AccessNon-destructive thickness characterisation of 3D multilayer semiconductor devices using optical spectral measurements and machine learning
Author(s) -
Hyunsoo Kwak,
Sungyoon Ryu,
Suil Cho,
Junmo Kim,
Yusin Yang,
Jungwon Kim
Publication year - 2020
Publication title -
light advanced manufacturing
Language(s) - English
Resource type - Journals
eISSN - 2831-4093
pISSN - 2689-9620
DOI - 10.37188/lam.2020.004
Subject(s) - materials science , semiconductor , optoelectronics , semiconductor device , composite material , layer (electronics)
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