Open AccessInvestigation of the effect of using preheated aggregate and modified binder on chip seal adhesion properties
Author(s) -
Cahit Gürer,
Burak Enis Korkmaz,
Ayfer Elmacı,
Mohammad Babour Rahmany
Publication year - 2022
Publication title -
journal of engineering research
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.168
H-Index - 9
eISSN - 2307-1885
pISSN - 2307-1877
DOI - 10.36909/jer.17927
Subject(s) - asphalt , seal (emblem) , aggregate (composite) , adhesion , asphalt pavement , materials science , chip , composite material , phosphoric acid , metallurgy , engineering , art , visual arts , electrical engineering
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