Open AccessSOLDER SEALING of CONNECTORS IN SOLID-STATE MICROWAVE MODULES. PROBLEMS AND SOLUTIONS
Author(s) -
A. S. Sonevitskiy,
В. С. Жуков
Publication year - 2020
Publication title -
èlektronnaâ tehnika. seriâ 2. poluprovodnikovye pribory
Language(s) - English
Resource type - Journals
ISSN - 2073-8250
DOI - 10.36845/2073-8250-2020-259-4-37-42
Subject(s) - soldering , microwave , solid state , tin , materials science , mechanical engineering , current (fluid) , electrical engineering , engineering , computer science , engineering physics , forensic engineering , telecommunications , metallurgy
This article presents the study of a promising technology utilizing the tin-lead solder for the sealing of current-transmitting components of modern solid-state microwave modules: connectors, leads and others. This technology was developed and implemented at the S&PE Pulsar JSC. The article highlights the advantages and disadvantages of the technique, presents the diagrams of the structures used.