Open AccessFEATURES OF MICROWAVE GaN POWER AMPLIFIER DIES SOLDER BONDING
Author(s) -
I.S. Benuni,
O.Yu. Dyakonitsa,
A.O. Klimov,
N.A. Pavlyuk-Moroz,
Al.V. Redka
Publication year - 2017
Publication title -
èlektronnaâ tehnika. seriâ 2. poluprovodnikovye pribory
Language(s) - English
Resource type - Journals
ISSN - 2073-8250
DOI - 10.36845/2073-8250-2017-246-3-44-51
Subject(s) - materials science , amplifier , microwave , soldering , die (integrated circuit) , optoelectronics , microwave power , power (physics) , electrical engineering , composite material , engineering , telecommunications , nanotechnology , cmos , physics , quantum mechanics