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THE USE OF ORGANIC COMPOUNDS CONTAINING THE TRIPLE BOND C≡C IN THE PROCESS OF ELECTROCHEMICAL NICKEL PLATING
Author(s) -
Aleksandr Kuznecov,
Nina Sosnovskaya
Publication year - 2022
Publication title -
sovremennye tehnologii i naučno-tehničeskij progress
Language(s) - English
Resource type - Journals
ISSN - 2686-9896
DOI - 10.36629/2686-9896-2022-1-25-26
Subject(s) - nickel , electrochemistry , triple bond , plating (geology) , materials science , double bond , chemistry , inorganic chemistry , polymer chemistry , chemical engineering , metallurgy , electrode , engineering , geology , geophysics

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