z-logo
open-access-imgOpen Access
Leaching Cu from e-waste PCB using thiourea solution and oxidizing H2O2
Author(s) -
Tiara Triana,
Soesaptri Oediyani,
Rindang Puspa Rini,
Tio Aji Pamungkas
Publication year - 2021
Publication title -
teknika jurnal sains dan teknologi
Language(s) - English
Resource type - Journals
eISSN - 2654-4113
pISSN - 1693-024X
DOI - 10.36055/tjst.v17i2.12875
Subject(s) - oxidizing agent , leaching (pedology) , thiourea , waste management , electronic waste , chemistry , metallurgy , materials science , environmental science , engineering , organic chemistry , soil water , soil science

The content you want is available to Zendy users.

Already have an account? Click here to sign in.
Having issues? You can contact us here
Accelerating Research

Address

John Eccles House
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom