Open AccessThe Development of Low-Temperature Lead-Free Solders using Sn-Bi Solders Alloys
Author(s) -
Muhamad Syafiq Hashim,
O. Saliza Azlina,
M.N. Ervina Efzan
Publication year - 2019
Publication title -
international journal of recent technology and engineering
Language(s) - English
Resource type - Journals
ISSN - 2277-3878
DOI - 10.35940/ijrte.d9913.118419
Subject(s) - soldering , materials science , interconnection , electronics , metallurgy , electronic packaging , alloy , enhanced data rates for gsm evolution , solderability , lead (geology) , reliability (semiconductor) , substructure , composite material , computer science , engineering , electrical engineering , structural engineering , computer network , telecommunications , power (physics) , physics , quantum mechanics , geomorphology , geology
Lead-free solders have been the substructure innovation of electronic interconnections for many decenniums due to the widespread utilization of electronic contrivances. SnAg–Cu (SAC) is presently seen as the popular lead-free solder alloy for bundling interconnects in the electronics industry. In this review, the study on the development of low-temperature Pbfree solders using Sn-Bi solder alloys will be discussed regarding thermal behaviour and wettability. The impact of alloying on these compounds is depicted as far as basic microstructural changes, mechanical properties, and reliability. The review closes with a perspective for cutting edge electronic interconnect materials.