The Development of Low-Temperature Lead-Free Solders using Sn-Bi Solders Alloys | Zendy

M. S. Hashim | Zendy; O. Saliza Azlina | Zendy; Ervina Efzan Mhd Noor | Zendy

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The Development of Low-Temperature Lead-Free Solders using Sn-Bi Solders Alloys

Author(s) -

M. S. Hashim,

O. Saliza Azlina,

Ervina Efzan Mhd Noor

Publication year - 2019

Publication title -

international journal of recent technology and engineering (ijrte)

Language(s) - English

Resource type - Journals

ISSN - 2277-3878

DOI - 10.35940/ijrte.d9913.118419

Subject(s) - soldering , materials science , interconnection , metallurgy , electronics , electronic packaging , alloy , solderability , enhanced data rates for gsm evolution , lead (geology) , reliability (semiconductor) , substructure , composite material , computer science , electrical engineering , computer network , telecommunications , power (physics) , physics , structural engineering , quantum mechanics , geomorphology , geology , engineering

Lead-free solders have been the substructure innovation of electronic interconnections for many decenniums due to the widespread utilization of electronic contrivances. SnAg–Cu (SAC) is presently seen as the popular lead-free solder alloy for bundling interconnects in the electronics industry. In this review, the study on the development of low-temperature Pbfree solders using Sn-Bi solder alloys will be discussed regarding thermal behaviour and wettability. The impact of alloying on these compounds is depicted as far as basic microstructural changes, mechanical properties, and reliability. The review closes with a perspective for cutting edge electronic interconnect materials.

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