Open AccessForced Convection upon Heat Sink of AL-Cu for Design Optimization by Experimental and CFD Analysis for cooling of ICs in CPU.
Author(s) -
Srinivas Doddapaneni,
S Ramamurthy,
Juhi Ansari
Publication year - 2019
Publication title -
international journal of recent technology and engineering
Language(s) - English
Resource type - Journals
ISSN - 2277-3878
DOI - 10.35940/ijrte.d7925.118419
Subject(s) - heat sink , thermocouple , forced convection , computational fluid dynamics , heat transfer coefficient , materials science , heat transfer , sink (geography) , mechanics , mechanical engineering , convection , thermodynamics , nuclear engineering , engineering , composite material , physics , cartography , geography
A heat sink device is used with specific power input at 100V and 20W by the heater attached at the base plate of copper and then obtaining the average temperature of Heat sink by the help of 10 thermocouples .Two specimens of heat sinks were designed and were tested for mass flow rate and heat transfer coefficient. With base of 1.5mm&2.5mmtip thickness and another specimen with dimensions as tip0.5mm and1.00mmbase thickness are used By experimenting and CFD simulations,optimization of heat sink design was done.Then correlation and Validation foe both the specimen was done and were found satisfactory results.