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Design, Implementation and Power Analysis of Low Voltage Heterojunction Tunnel Field Effect Transistor based Basic 6T SRAM Cell
Author(s) -
B V V Satyanarayana,
M. Durga Prakash
Publication year - 2019
Publication title -
international journal of innovative technology and exploring engineering
Language(s) - English
Resource type - Journals
ISSN - 2278-3075
DOI - 10.35940/ijitee.k2437.0981119
Subject(s) - mosfet , cmos , electrical engineering , transistor , subthreshold conduction , static random access memory , electronic engineering , tunnel field effect transistor , pmos logic , engineering , computer science , voltage , field effect transistor
The battery-powered mobile devices limited energy process by MOSFET's due to subthreshold swing and underneath 60mV/dec for ultra fewer energy applications. This research introduces the layout and execution of a mobile electronic device full-on-presence, extended Miller potential, and reduced HETT subthreshold swing effectiveness has been compared with MOSFET's Gate oxide blending on source can increase channel tunneling in this work. To enhance transistor line, Miller capacitance impact can be decreased by using low band offset equipment and small power product of metals such as Ge or SiGe. This, in turn, leads to stronger transistor efficiency features. The proposed layout and execution of HETT includes manufacturing of mutually NHETT and PHETT and efficiency analyzes of both NHETT and PHETT. Concerning the fundamental and skeletal distinctions among MOSFET and HETT to promote the utilization of MOSFET instead of HETT, the benefits and constraints of both NHETT and PHETT have been detailed. HETT's construction process is by no means entirely different, suitable for the scheme of MOS method and suitable for transportable motorized applications. HETT provides the 6T SRAM cell electricity evaluation and the output was reviewed using standard SRAM cell. The average power, maximum power and minimum power of SRAM by using both MOSFET and HETT are obtained and compared. The mask layers of HETT fabrication is not that much difference than MOSFET and hence CMOS MOSFET fabrication is friendly to HETT fabrication. In future, the combination of both CMOS MOSFET and HETT are used, CMOS technology for digital logic and HETT for semiconductor memory applications.

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