Open AccessDesign of Heat Sink and Thermal Analysis for Electronics Applications
Author(s) -
T Ramesh.,
Ramesh Velumayil,
K Karthik.
Publication year - 2019
Publication title -
international journal of innovative technology and exploring engineering
Language(s) - English
Resource type - Journals
ISSN - 2278-3075
DOI - 10.35940/ijitee.k1745.0981119
Subject(s) - heat sink , electronics , power electronics , operating temperature , electronic component , materials science , mechanical engineering , heat pipe , thermal conduction , passive cooling , electronics cooling , thermal , thermal conductivity , heat flux , thermal resistance , thermal analysis , thermal grease , electronic packaging , heat transfer , electrical engineering , mechanics , engineering , composite material , thermodynamics , physics , voltage
The now days electronics compound very important of human life its high temperature generated during operating, it is problem take in account in this paper, so overcome this problem need to thermal management. When the increase the temperature due to reduce the compound life time. In this paper to analysis using Finite element analysis focuses on the passive cooling of electronics devices by using fin configuration, different heat flux, and materials like aluminum (6062), Copper, Tungsten to ensure lower temperature compare with maximum operating temperature, all electronic components generate heat during of their operation. To ensure best working of the electronics component, the produced heat needs to be removed using thermal management techniques. Finally more heat dissipated material with design aspect Tungsten suitable material for high input power for electronic compounds because the thermal conductivity high and low thermal gradient.