Open AccessFDTD modeling for Crosstalk Reduction in Coupled RLC Interconnects with Active Shielding
Author(s) -
Mrs R. Sridevi*,
P. Chandra Sekhar,
Dr.B.K. Madhavi,
T. Satya Savithri
Publication year - 2019
Publication title -
international journal of innovative technology and exploring engineering
Language(s) - English
Resource type - Journals
ISSN - 2278-3075
DOI - 10.35940/ijitee.j1100.0981119
Subject(s) - finite difference time domain method , rlc circuit , crosstalk , electromagnetic shielding , electronic engineering , resistive touchscreen , spice , noise reduction , computer science , electrical engineering , physics , acoustics , engineering , optics , voltage , capacitor
This paper presents efficient geometry for crosstalk noise and delay reduction using Active shielding in RLC interconnects with resistive drivers .FDTD modeling has been used for proposed geometry and is validated by HSPICE simulations for 32nm global interconnects .From the results it has been verified that the proposed model results and HSPICE simulations differ by 5% . From the outcomes it has been confirmed that the proposed model outcomes and HSPICE outcomes differ by 5% and by using proposed geometry crosstalk noise and delay has come down by 73% and 60% when compared to unshielded line