Open AccessCFD Modeling on Thermal Management of IC using Water Based Fe, Cu and Al Nanofluids
Author(s) -
Nirmal Kumar Kund
Publication year - 2019
Publication title -
international journal of engineering and advanced technology
Language(s) - English
Resource type - Journals
ISSN - 2249-8958
DOI - 10.35940/ijeat.f8412.088619
Subject(s) - nanofluid , computational fluid dynamics , mechanics , convection , materials science , thermal , thermodynamics , mechanical engineering , heat transfer , engineering , physics
In unrelenting civility, CFD codes are developed and simulated with water based Fe, Cu and Al nanofluids for foreseeing the heat alarms of ICs. The convective governing equalities of mass, force and drive are computed for envisaging the thermal issues of ICs. The time pace selected throughout the intact computation is 0.0001 s. The soundings affect CFD forecasts of temperature curve, temperature arena plus fluid-solid boundary temperature of IC. Corresponding fluid-solid boundaries temperatures of IC are viewed as 321, 309 and 313 K for water based Fe, Cu and Al nanofluids, one-to-one. The temperature of water-Cu nanofluid stands peak contiguous to the IC locality as it stands far less than the chancy temperature limit of 356 K. Further, the temperature of water-Cu nanofluid gently drops with improvement in aloofness from IC. Afterwards, this becomes surrounding temperature in the distant arena precinct. The analogous tinted temperature curve stands accessible. In addition, the congruent plot of temperature verses distance from IC stays revealed. The uneasiness of CFD compassionate position nearby the conveniences of jargons.