Open AccessEvaluation of High Speed Communication Interfaces for Next Generation Secure Element
Author(s) -
G Vamsi Krishna Reddy*,
G S Sharvani
Publication year - 2021
Publication title -
international journal of engineering and advanced technology
Language(s) - English
Resource type - Journals
ISSN - 2249-8958
DOI - 10.35940/ijeat.e2737.0610521
Subject(s) - interface (matter) , throughput , computer science , element (criminal law) , focus (optics) , host (biology) , key (lock) , embedded system , smart card , feature (linguistics) , computer network , computer hardware , operating system , wireless , ecology , linguistics , philosophy , physics , optics , bubble , maximum bubble pressure method , political science , law , biology
Secure element is a microprocessor chip that providesa secure environment to store the data, execute the applicationsand communicate the data to external entities securely. As secureelement provides a promising security feature, it is used in variousdomains like IOT, automobile and mobile phones. Nowadays, thesize of the security key and size of the data to be processed areincreasing whereas the processing time of the secure element isexpected to reduce. As the data size increases, the time tocommunicate the data between secure element and host increases.Host and secure element are connected via SPI over ISO IEC7816-4 (T1) communication interface. In this paper, we evaluatethe throughput of SPI over ISO IEC 7816-4 (T1) interface whichis widely used in smart card domains. Throughput of the interfaceis evaluated by examining the time spent at communicationinterface for varying data size. We focus on understanding theparameters that affect the throughput of the SPI over T1 interface.