Open AccessHeat Transfer using Nanofluid
Author(s) -
Jodh Singh,
AUTHOR_ID,
Munish Kumar Gupta,
Ramesh Kumar,
Harish Kumar,
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AUTHOR_ID,
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Publication year - 2019
Publication title -
international journal of engineering and advanced technology
Language(s) - English
Resource type - Journals
ISSN - 2249-8958
DOI - 10.35940/ijeat.b9230.129219
Subject(s) - nanofluid , thermal conductivity , materials science , heat transfer , nanoparticle , miniaturization , economies of agglomeration , copper oxide , chemical engineering , nanotechnology , thermodynamics , copper , composite material , metallurgy , physics , engineering
Latest trend of miniaturization of thermal systems, calls for the improvement in their efficiency. Nanofluid contains the nanoparticles having large surface area and improves the thermal efficiency. This enhancement is the function of different mechanisms and parameter. This paper explores the heat transfer nature of nanofluids by addressing the experimental studies available in literature and conducting an experimental study using water based Copper oxide nanofluids. Nanoparticles were characterized by X-ray diffraction analysis and Field Emission Scanning Electron Microscopy to confirm the material, size and morphology of the nanoparticles. Thermal conductivity analysis has been performed at 30˚C, 40˚Cand 50˚C with 0.1%,0.5% and 1% concentration by weight. Mechanism of agglomeration, concentration and size of particles are found to be more significant in affecting the heat transfer. The maximum enhancement of 22.9 % in thermal conductivity is found in case of 1% weight concentration nanofluids consisting of small size (20nm) nanoparticles at temperature of 50˚C.