Influence of residual dopants to net doping concentration in N-type 4H-SiC films grown using high-speed wafer rotation vertical CVD method
Author(s) -
Yoshiaki Daigo,
Yuya Takada,
Keisuke Kurashima,
Tôru Watanabe,
Akio Ishiguro,
Shigeaki Ishii,
Yoshikazu Moriyama,
Ichiro Mizushima
Publication year - 2022
Publication title -
japanese journal of applied physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.487
H-Index - 129
eISSN - 1347-4065
pISSN - 0021-4922
DOI - 10.35848/1347-4065/ac4c08
Subject(s) - dopant , doping , materials science , epitaxy , analytical chemistry (journal) , wafer , residual , volumetric flow rate , chemistry , nanotechnology , optoelectronics , chromatography , thermodynamics , layer (electronics) , physics , algorithm , computer science
In this study, the influence of residual dopants on the net doping concentration in n-type 4H-SiC epitaxial films grown at different N 2 flow rates and C/Si ratios were investigated. By reducing the N 2 flow rate, the influence of the residual donors on the net doping concentration was observed to become dominant for the films grown at low C/Si ratios and that of the residual acceptors on the net doping concentration becomes dominant for the films grown at high C/Si ratios. For the films grown at the middle C/Si ratio, an apparent proportional relation due to the compensation balance between the residual and intentional donors and the residual acceptors was observed in the N 2 flow rate dependence of the net doping concentration. Furthermore, the decay curve of the net doping concentration observed in the C/Si ratio dependence is affected by the compensation balance between the intentional dopant concentration and the residual dopant concentration.
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