Open AccessHigh-performance p-channel transistors on flexible substrate using direct roll transfer stamping
Author(s) -
Ayoub Zumeit,
Abhishek Singh Dahiya,
Adamos Christou,
Ravinder Dahiya
Publication year - 2022
Publication title -
japanese journal of applied physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.487
H-Index - 129
eISSN - 1347-4065
pISSN - 0021-4922
DOI - 10.35848/1347-4065/ac40ab
Subject(s) - transistor , materials science , optoelectronics , fabrication , wafer , flexible electronics , nanotechnology , silicon on insulator , electronics , substrate (aquarium) , leakage (economics) , stamping , silicon , thin film transistor , electronic circuit , electrical engineering , voltage , engineering , layer (electronics) , medicine , oceanography , alternative medicine , pathology , geology , metallurgy , economics , macroeconomics
Flexible electronics with high-performance devices are crucial for transformative advances in several emerging and traditional applications. To address this need, herein we present p -type silicon (Si) nanoribbons (NR)-based high-performance field-effect transistors (FETs) developed using an innovative direct roll transfer stamping (DRTS) process. First, ultrathin Si NRs (∼70 nm) are obtained from silicon on insulator wafers using the conventional top-down method, and then the DRTS method is employed to directly place the NRs onto flexible substrates at RT. The NRFETs are then developed following the RT fabrication process which includes deposition of high-quality SiN x dielectric. The fabricated p -channel transistors demonstrate high linear mobility ∼100 ± 10 cm 2 V −1 s −1 , current on/off ratio >10 4 , and low gate leakage (<1 nA). Further, the transistors showed robust device performance under mechanical bending and at a wide temperature range (15 °C–90 °C), showing excellent potential for futuristic high-performance flexible electronic devices/circuits.