Open AccessRESEARCH OF THE PROCESS OF DEPOSITION OF GALVANIC COPPER SEDIMENTS BY PULSE CURRENTS
Author(s) -
В. Т. Фомичев,
A. V. Savchenko,
G. P. Gubarevich
Publication year - 2021
Publication title -
izvestiâ volgogradskogo gosudarstvennogo tehničeskogo universiteta
Language(s) - English
Resource type - Journals
ISSN - 1990-5297
DOI - 10.35211/1990-5297-2021-4-251-81-85
Subject(s) - copper , electrolyte , galvanic cell , metallurgy , materials science , copper plating , indentation hardness , plating (geology) , deposition (geology) , electrolytic process , electrolysis , electrode , electroplating , chemistry , microstructure , geology , composite material , sediment , paleontology , layer (electronics) , geophysics
Research has been carried out on the process of copper electrodeposition from fluoride-hydrogen-boron electrolytes of copper plating by pulsed currents. The influence of the electric mode on the quality of the obtained copper deposits was studied: copper current efficiency, microhardness, specific electrolytic resistance, and internal voltages of the deposits.