Open Access<strong>HIGH-SPEED PACKAGING FOR SILICON MODULATOR</strong>
Author(s) -
Yadong Liu,
Tao Chu
Publication year - 2017
Language(s) - Uncategorized
Resource type - Conference proceedings
DOI - 10.3390/optofluidics2017-04387
Subject(s) - materials science , optoelectronics , silicon photonics , silicon , electro optic modulator , modulation (music) , photonics , optical modulator , hybrid silicon laser , radio frequency , electrical engineering , electronic engineering , engineering , phase modulation , physics , acoustics , phase noise