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Effect of Solvent Pre-Treatment on the Leaching of Copper During Printed Circuit Board Recycling
Author(s) -
A. Hammad Tarek,
Giuliana Schimperna,
G. Cantoni,
F. Demichelis,
Debora Fino,
Sara Perucchini,
Francesca Rubertelli,
F. Laviano
Publication year - 2025
Publication title -
recycling
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.569
H-Index - 14
ISSN - 2313-4321
DOI - 10.3390/recycling10030080
Subject(s) - printed circuit board , copper , leaching (pedology) , solvent , materials science , waste management , chemistry , metallurgy , environmental science , engineering , organic chemistry , electrical engineering , soil science , soil water

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