Open AccessElectroless Copper Nano Thin Film Deposition Using Ecofriendly Natural Polyhydroxylic Compound
Publication year - 2018
Publication title -
journal of chemistry: education research and practice
Language(s) - English
Resource type - Journals
ISSN - 2578-7365
DOI - 10.33140/jcerp/02/01/03
Subject(s) - copper , potassium hydroxide , scanning electron microscope , materials science , cyclic voltammetry , electrochemistry , copper plating , plating (geology) , reducing agent , crystallite , coating , nuclear chemistry , inorganic chemistry , chemical engineering , chemistry , metallurgy , electrode , layer (electronics) , nanotechnology , organic chemistry , electroplating , composite material , geophysics , geology , engineering
Copper electroless plating using polyhydroxylic alcohol was studied electrochemically using Dimethylamineborane(DMAB) as reducing agent. Copper methanesulphonate bath was used with Glycerol as the complexing agent and Potassium hydroxide as pH adjuster. The electroless bath was optimized by addition of 1 ppm concentration of stabilizers at 11.50 ± 0.25 pH. Tolytriazole(TTA) and Cytosine(CYS) are used as stabilizers and their effects on plating bath were studied and reported. Surface morphologies of the electroless copper coated epoxy substrates were investigated using Scanning Electron Microscope (SEM) and surface roughness by Atomic Force Microscopic (AFM) analysis. Crystallite size and specific surface area of copper thin film were observed by X-ray diffraction (XRD). Electrochemical characteristics were studied by Cyclic Voltammetry (CV). The physical parameters of the deposition shows that TTA influenced the copper coating while the CYS does not show much effect.