Open AccessSelective Soldering on Printed Circuit Boards with Endogenous Induction Heat at Appropriate Susceptors
Author(s) -
Dirk Seehase,
Christian Kohlen,
Arne Neiser,
Andrej Novikov,
Mathias Nowottnick
Publication year - 2018
Publication title -
periodica polytechnica. electrical engineering and computer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.158
H-Index - 13
eISSN - 2064-5279
pISSN - 2064-5260
DOI - 10.3311/ppee.13277
Subject(s) - induction heating , printed circuit board , susceptor , soldering , transversal (combinatorics) , materials science , field (mathematics) , dip soldering , mechanical engineering , heating element , electromagnetic induction , wave soldering , electrical engineering , composite material , electromagnetic coil , engineering , mathematical analysis , epitaxy , mathematics , layer (electronics) , pure mathematics
In this work, methods for the endogenous heating of printed circuit boards (PCBs) by means of inductive losses in built-in susceptors are presented. Two basic types of inductive heating were studied, the heating in the transversal field and the heating in the longitudinal field. Elementary test stands were constructed and characterized for both field geometries. These setups were then used to analyze various susceptor materials like copper and aluminum for the transversal field heating and nickel and iron for the longitudinal field heating. To demonstrate the soldering processes by means of inductive heating, exemplary processes were conducted on both test stands by emulating a standard solder reflow profile. The limitations of using induction heating on printed circuit boards are illustrated by component lead frames, which also heat up in the inductive field and can hence be damaged.In short, this paper presents a selective heating method, based on induction heating, for printed circuit boards. Furthermore possible setups for implementing this heating method are described.