
Hard IP Core Nondestructive Testing Technology
Author(s) -
Kun Yu,
Hua Wang
Publication year - 2019
Publication title -
journal of microelectronic manufacturing
Language(s) - Uncategorized
Resource type - Journals
ISSN - 2578-3769
DOI - 10.33079/jomm.19020201
Subject(s) - core (optical fiber) , nondestructive testing , computer science , telecommunications , physics , quantum mechanics