Open AccessEffect of thermal method of assembling parts on the bond strength of dissimilar materials
Author(s) -
L Nikolenko
Publication year - 2016
Publication title -
mašinobuduvannâ
Language(s) - English
Resource type - Journals
ISSN - 2079-1747
DOI - 10.32820/2079-1747-2016-17-134-138
Subject(s) - materials science , bond strength , composite material , thermal , bond , structural engineering , engineering , physics , business , adhesive , thermodynamics , finance , layer (electronics)