Open AccessSelective Electroless Precipitation Of Copper On Non - Conductive Surfaces Using The Semiconductor Zinc Oxide.
Publication year - 2008
Publication title -
university of thi-qar journal of science
Language(s) - English
DOI - 10.32792/thi/sc/vol.1.is.1.05
Subject(s) - materials science , copper , zinc , electrical resistivity and conductivity , ceramic , fabrication , oxide , precipitation , metallurgy , electrical conductor , copper plating , composite material , layer (electronics) , electroplating , electrical engineering , medicine , alternative medicine , physics , pathology , meteorology , engineering
Zinc oxide layer being thermally precipitated on glass and ceramicstrips ( 2x2.5 cm ) before the electroless precipitation of copper utilizingthe conventional Printed Circuit Boards( PCB) technologies inconjunction with the required modifications to optimize the quality ofthese layers .The roughness of ZnO films was Ra 0.02 µm and its thickness about 0.7µm. The films being characterized by X- ray diffraction . The bivalentPd( І І ) used as activator was reduced to Pd (0) on surface of ZnO layerby UV light in 1.5 – 2 minutes intervals . Copper lines precipitated in the subsequent steps have an adhesionpower of 2and 5 kg.mm-2 on glass and ceramic respectively . The specific conductance of the electrolessly deposited copper was found to be( 5.3x106)ohm-1.cm-1, and the resistivity was ( 1.8 x10 -6)ohm.cm . From theresults of this study the method could be utilized in PCB fabrication