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Effect of Dimple Arrangement on The Thermal Performance of Dimpled Stepped Plate Heat Sink
Author(s) -
Sharath Kumar S N,
S. Sathish,
H. R. Purushothama
Publication year - 2022
Publication title -
international journal of scientific research in science, engineering and technology
Language(s) - English
Resource type - Journals
eISSN - 2395-1990
pISSN - 2394-4099
DOI - 10.32628/ijsrset2293112
Subject(s) - dimple , heat sink , thermal , materials science , fin , mechanical engineering , mechanics , thermal management of electronic devices and systems , sink (geography) , composite material , engineering , thermodynamics , physics , cartography , geography

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