Open AccessOptimization study on Electrical Enclosure with Forced Convection cooling using Computational Fluid Dynamics
Author(s) -
Mohammed Nabeel Ahmed,
B. Meghanath,
Mayur Laxman Kesarkar,
N Lakshminarasimha
Publication year - 2020
Publication title -
international journal of scientific research in science, engineering and technology
Language(s) - English
Resource type - Journals
eISSN - 2395-1990
pISSN - 2394-4099
DOI - 10.32628/ijsrset207219
Subject(s) - enclosure , computational fluid dynamics , mechanics , baffle , fluent , mechanical engineering , inlet , materials science , engineering , electrical engineering , physics
Any electronic walled in area comprises of heat creating electronic components, as heat produced by the electronic parts in a fenced in area decreases the life of electronic segments prompting serious harm or disappointment of the framework. Research shows that each 10°c rise above room temperature of the enclosure, the life of the electronic parts decreases. Thus for any electronic frameworks, cooling turns into a significant structure interest, practical and ideal answer for hold the electronic parts to its working limit. Therefore, in the present work CFD simulation has been carried out using ANSYS Fluent by considering a typical Aluminum Electrical enclosure of volume (150mm X 600mm X 250mm) with total internal heat dissipation of 84W. With those values into consideration the surface area of enclosure, enclosure temperature rise, air flow requirement in an enclosure is calculated and based on which the fan is selected. Also optimization study has been carried out by changing the inlet opening position, exhaust fan location and providing baffle at inlet opening location. The results obtained from analysis are validated with analytical results.