Open AccessLocal Stress Field in Wafer Thinning Simulations with Phase Space Averaging
Author(s) -
Miaocao Wang,
Yuhua Huang,
Jinming Li,
Ling Xu,
Fulong Zhu
Publication year - 2021
Publication title -
computers, materials and continua/computers, materials and continua (print)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.788
H-Index - 40
eISSN - 1546-2226
pISSN - 1546-2218
DOI - 10.32604/cmc.2021.016372
Subject(s) - wafer , ingot , semiconductor , nanoscopic scale , thinning , materials science , field (mathematics) , nanotechnology , semiconductor industry , mechanism (biology) , phase space , stress (linguistics) , optoelectronics , physics , engineering , composite material , mathematics , manufacturing engineering , thermodynamics , quantum mechanics , biology , alloy , linguistics , philosophy , pure mathematics , ecology
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