ANALISIS INTERFACIAL REACTION ANTARA SUBSTRATE Cu DAN SOLDER 96.5Sn3.0Ag-0.5Cu (SAC305) UNTUK PENGEMBANGAN APLIKASI SEMIKONDUKTOR | Zendy

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ANALISIS INTERFACIAL REACTION ANTARA SUBSTRATE Cu DAN SOLDER 96.5Sn3.0Ag-0.5Cu (SAC305) UNTUK PENGEMBANGAN APLIKASI SEMIKONDUKTOR

Author(s) -

Rima Nurhaliza

Publication year - 2021

Publication title -

jst (jurnal sains terapan)

Language(s) - Romanian

Resource type - Journals

eISSN - 2477-5525

pISSN - 2406-8810

DOI - 10.32487/jst.v7i1.1102

Subject(s) - materials science , soldering , nuclear chemistry , substrate (aquarium) , metallurgy , physics , chemistry , oceanography , geology

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