Open AccessANALISIS INTERFACIAL REACTION ANTARA SUBSTRATE Cu DAN SOLDER 96.5Sn3.0Ag-0.5Cu (SAC305) UNTUK PENGEMBANGAN APLIKASI SEMIKONDUKTOR
Author(s) -
Rima Nurhaliza,
Andromeda Dwi Laksono,
Hizkia Alpha Dewanto,
Andi Idhil Ismail
Publication year - 2021
Publication title -
jst (jurnal sains terapan)
Language(s) - Romanian
Resource type - Journals
eISSN - 2477-5525
pISSN - 2406-8810
DOI - 10.32487/jst.v7i1.1102
Subject(s) - materials science , soldering , nuclear chemistry , substrate (aquarium) , metallurgy , physics , chemistry , oceanography , geology