Open AccessProperties of epoxy-thiokol materials based on the products of the preliminary reaction of thioetherification
Author(s) -
К.М. Sukhyy,
Elena Belyanovskaya,
Алла М. Носова,
M.K. Sukhyy,
V.P. Kryshen,
Yudong Huang,
Юрій С. Кочергін,
T. Hryhorenko
Publication year - 2021
Publication title -
voprosy himii i himičeskoj tehnologii/voprosy himii i himičeskoj tehnologii
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.278
H-Index - 7
eISSN - 2413-7987
pISSN - 0321-4095
DOI - 10.32434/0321-4095-2021-136-3-128-136
Subject(s) - epoxy , adhesive , materials science , curing (chemistry) , differential scanning calorimetry , composite material , izod impact strength test , composite number , epoxy adhesive , heat resistance , order of reaction , ultimate tensile strength , kinetics , reaction rate constant , thermodynamics , physics , layer (electronics) , quantum mechanics
In order to improve the adhesive and physical-mechanical properties of epoxy-thiocol compositions cured without heat treatment, we propose to carry out the reaction of interaction between thiokol mercaptan groups and oxirane cycles of epoxy resin at an elevated temperature before introducing a curing agent, and then use the product of this thioetherification reaction for curing at room temperature. The temperature range of the thioetherification reaction (90–1800С) was determined by the method of differential scanning calorimetry. The optimal temperature (1600С) and duration of the preliminary thioetherification reaction (2 hours) were determined, which ensure the maximum level of adhesive strength and physical-mechanical properties. It was shown that composite materials based on the products of the thioetherification reaction significantly outperform analogs based on mechanical mixtures of epoxy resin and thiokol in terms of cohesive and adhesive strength, deformation capacity, fracture work and specific impact strength. The impact resistance and shear strength of adhesive joints are especially significantly increased during the curing of the compositions without external heat supply.