Open AccessApplication of Systems for Complex Integrative Automatic Assembly of Electronic Components Super Systems and Subsystems with Pre-Stamping of Incoming Parts and Elements
Author(s) -
Д. В. Шеховцов
Publication year - 2020
Publication title -
intellectual archive
Language(s) - English
Resource type - Journals
ISSN - 1929-4700
DOI - 10.32370/ia_2020_12_7
Subject(s) - process (computing) , stamping , computer science , mode (computer interface) , systems engineering , engineering , mechanical engineering , human–computer interaction , operating system
An essential part of any production process is to actively monitor the parameters of these processes in real time. The most promising method of active real time monitoring is non contact monitoring or monitoring in the mode of electromagnetic resonance spectroscopy. Since these methods are fundamentally new and are only being implemented in technological processes, it makes sense to consider them in more detail.