Open AccessThe formation of Cu[subscript x]Sn[subscript y] intermetallic compounds in Controlled Collapse Chip Connection (C4)
Author(s) -
Indu Aggarwal
Publication year - 2019
Language(s) - English
Resource type - Dissertations/theses
DOI - 10.31979/etd.fey5-y9em
Subject(s) - intermetallic , connection (principal bundle) , materials science , metallurgy , mathematics , geometry , alloy