Open AccessStatic analysis of bond between prestressing strand and UHPC exposed to elevated temperatures
Author(s) -
David Čítek,
Jindřich Čech,
Petr Pokorný,
Jiřı́ Kolı́sko
Publication year - 2021
Publication title -
materials-structure-technology
Language(s) - English
Resource type - Journals
ISSN - 2570-6616
DOI - 10.31448/mstj.03.01.2020.102-107
Subject(s) - materials science , deflection (physics) , composite material , composite number , annealing (glass) , structural engineering , numerical analysis , engineering , physics , mathematics , mathematical analysis , optics
This article deals with the numerical analysis of the bond of a prestressing strand with UHPC heated to elevated temperatures and subsequently cooled. Numerical analysis was performed with experimentally determined material properties of UHPC at a reference temperature of 20 °C and further after heating to temperatures of 200, 400 and 600 °C and subsequent annealing to normal temperature. The resulting deflection depending on the pulling force from the numerical analysis were compared with the experimental results. The results are used to configure the cement composite model for more demanding simulations of structures and load cases.