Curing behavior and thermal properties of trifunctional epoxy resin cured by 4, 4’-diaminodiphenyl sulfone

A novel trifunctional epoxy resin 4-(3, 3-dihydro-7-hydroxy-2, 4, 4-trimethyl-2H-1-benzopyran-2-yl)-1, 3-benzenediol glycidyl (shorted as TMBPBTH-EPOXY) was synthesized in our lab to improve thermal performance. Its curing behavior and performance were studied by using 4, 4′-diaminodiphenyl sulfone (DDS) as hardener with the mass ratio of 100:41 of TMBPBTH-EPOXY and DDS. The curing activation energy was investigated by differential scanning calorimetry (DSC) to be 64.0 kJ/mol estimated by Kissinger’s method and 68.7 kJ/mol estimated by Flynn-Wall-Ozawa method respectively. Thermogravimetric analyzer (TGA) was used to investigate the thermal decomposition of cured compounds. It was found that when curing temperature was lower than 180°C, the thermal decomposition temperature increased with the rise of curing temperature and curing time. On the other hand, when the curing temperature was higher than 180°C, the thermal decomposition temperature went down instead with the increase of curing time that might be the over-crosslinking of TMBPBTH-EPOXY and DDS hardener. The glass transition temperature (Tg) of cured TMBPBTH-EPOXY/DDS compound determined by dynamic mechanical thermal analysis (DMTA) is 290.1°C