Open AccessINCREASING THE THICKNESS AND DEPOSITION RATE OF HIGH-PERFORMANCE ELECTROPLATED CoPt PERMANENT MAGNETS
Author(s) -
Y. Wang,
Jacob Ewing,
David P. Arnold
Publication year - 2018
Publication title -
2018 solid-state, actuators, and microsystems workshop technical digest
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2018.39
Subject(s) - electroplating , magnet , materials science , deposition (geology) , metallurgy , composite material , electrical engineering , geology , engineering , layer (electronics) , paleontology , sediment