Open AccessINCREASING THE THICKNESS AND DEPOSITION RATE OF HIGH-PERFORMANCE ELECTROPLATED CoPt PERMANENT MAGNETS
Author(s) -
Y. Wang,
Jacob Ewing,
David P. Arnold
Publication year - 2018
Publication title -
1998 solid-state, actuators, and microsystems workshop technical digest
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2018.39
Subject(s) - electroplating , materials science , coercivity , plating (geology) , fabrication , magnet , chemical mechanical planarization , current density , metallurgy , silicon , composite material , alloy , layer (electronics) , electrical engineering , condensed matter physics , engineering , geology , medicine , physics , alternative medicine , pathology , quantum mechanics , geophysics
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