Open AccessSTICTION AT HIGH TEMPERATURE (>250°C) IN ENCAPSULATED MEMS DEVICES FOR HARSH ENVIRONMENT APPLICATIONS
Author(s) -
David B. Heinz,
Vu A. Hong,
C.H. Ahn,
Yuan Yang,
Thomas W. Kenny
Publication year - 2016
Publication title -
1998 solid-state, actuators, and microsystems workshop technical digest
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2016.52
Subject(s) - stiction , microelectromechanical systems , materials science , silicon , degradation (telecommunications) , adhesion , optoelectronics , composite material , electronic engineering , engineering
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